Raised double-layer 10G design. 1.8A power delivery.
High-speed connector with BRASS contacts. 30V DC rating for data centers.
Shenzhen Gaorunxin Technology Co., Ltd
0.36mm mount height, reverse orientation. U2/U3 contacts.
Reverse-mount double-layer design. 30V DC, 100V dielectric strength.
Three-port stacked design. Non-spring contacts, DIP termination.
Double-to-single layer conversion. Raised base for thermal management.
GEN2 protocol, straight pins. Nickel-plated SUS shell.
Triple-layer stackable design. Front-accessible Type-C ports.
Rolled-edge + forked pins. Support feet, brass shell.
3.36mm height, straight-pin forward mount. 30m?? contact resistance.
Hybrid USB 3.0 + Type-C. 90 Degree orientation, nickel-plated SUS.
Three-layer stacked design. Fog-tin plated contacts.