24.9mm Semiconductor Test Probe| 1.311mm dia 1A | Used Test Wafer

Precision semiconductor test probes for IC testing, burn-in analysis & data communication. 0.3mm-2.54mm spacing solutions for chip packaging, AI devices, 5G communications, and RF testing. Custom probe configurations available for mobile tech, high-end connectors, and industrial applications.

Product Name: Semiconductor Test Probe
Catalog Number: DE1-131FB330-01C0
Current Rating: 2A
Contact Resistance: 200 mohms max
Bandwidth: [email protected]
Inductace: 2.02nH
Captance: 3.44pF

[email protected]

31.5mm Semiconductor Test Probe| 1.27mm dia 1A | Wafer test

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wafer probe Semiconductor Probe spring probe Semi Probe probe tips Wafer Probing

Product Details
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Semiconductor test probes are precision components specifically designed for integrated circuit (IC) verification across multiple critical stages.

Probe Tips

Material Plated:

Barrel:Brass / Gold Plated

Bottom:SK4(Be Cu)/Gold Plated

TOP:SK4(Be Cu)/Gold Plated

Spring:SWPB(SUS)/Gold Plated

Specification:

Full Stroke:6.0mm

Rated Stroke:2.0mm

Spring Force:[email protected]

Mechanical Life Exceeds:200K

Key applications include:
IC functional/parametric testing
Microneedle module burn-in & aging validation
Open/short circuit diagnostics
High-speed data communication signal integrity analysis

Technical Specifications:
Pitch compatibility: 0.3mm, 0.4mm, 0.5mm, 0.65mm, 0.75mm, 1.0mm, 1.27mm, 2.54mm
Probe configuration: Customizable based on test socket specifications
Frequency range: 5G-40G (DC to 40 GHz RF capability)
Performance characteristics: <0.5ohm contact resistance, <1dB insertion loss

Industry Applications:
Consumer electronics (mobile devices, computing systems)
Advanced connectivity solutions (high-end connectors, backplane interconnects)
Communication infrastructure (5G base stations, optical modules)
Emerging technologies (AI accelerators, automotive electronics)
These probes demonstrate exceptional performance in semiconductor wafer testing and advanced packaging validation, particularly in high-density probing scenarios requiring ultra-low contact resistance and multi-gigabit signal transmission stability.

Shenzhen Gaorunxin Technology Co., Ltd