Rolled-edge + forked pins. Support feet, brass shell.
Stabilized board-mount connector. 30V DC, 100M ohm insulation resistance.
Shenzhen Gaorunxin Technology Co., Ltd
Unrolled-edge reverse orientation. 1.8A/0.25A contact configuration.
Raised double-layer design. HDMI + USB 3.1 integration.
2.80mm mount height. Forward bent-pin design.
Double-to-single layer conversion with raised base. 30V DC, 100V dielectric strength.
2.63mm board-mount height, reverse orientation. 30V DC, 100M?? insulation.
GEN2 protocol, 3.40mm height. Forward bent-pin design.
4.31mm mount depth. SUS shell with nickel plating.
Rolled-edge forward design. Selective gold/tin plating on contacts.
Triple-layer 90 Degree design with bent pins. 1.5A current rating, UL94-V0 compliant.
Triple-layer stackable design. Front-accessible Type-C ports.