Rolled-edge + forked pins. Support feet, brass shell.
Stabilized board-mount connector. 30V DC, 100M ohm insulation resistance.
Shenzhen Gaorunxin Technology Co., Ltd
Full-surface SMT design. Nickel-plated brass shell.
90 Degree double-layer design with 4 pins. 1.5A current, 30V DC, UL94-V0 housing.
90 Degree dual Type-C ports. SUS shell, nickel plating.
0.36mm mount height, reverse orientation. U2/U3 contacts.
180 Degree Type-B female. SPCC shell, UL94-V0 housing.
13.70mm height. Nickel-plated brass shell.
Straight-pin DIP design. Brass/SUS shell, 1.5A current rating.
6.26mm height, straight pins. Copper alloy contacts.
Front-stackable design. Raised single layer, 10Gbps speed.
GEN2 protocol, straight pins. Nickel-plated SUS shell.