4.14mm height, reverse-mount design. No flange, brass shell.
On-board connector with 100V withstand voltage. Suitable for PCB surface mounting.
Shenzhen Gaorunxin Technology Co., Ltd
2.63mm board-mount height, reverse orientation. 30V DC, 100M?? insulation.
90 Degree dual Type-C ports. SUS shell, nickel plating.
Front-cutout for HDMI integration. 0.25A signal contacts.
Quad-port USB 3.0 AF connector. 1.8A power delivery per port.
Raised double-layer 10G design. 1.8A power delivery.
4.31mm board-mount depth. Forward orientation, bent pins.
12.80mm pitch, 90 Degree double-layer design. 30V DC, 100V withstand voltage.
Unrolled-edge reverse orientation. 1.8A/0.25A contact configuration.
GEN2 protocol, 3.40mm height. Forward bent-pin design.
Two-tone housing. 90 Degree bent pins, U2/U3 protocol support.