2.80mm mount height. Forward bent-pin design.
Surface-mount connector with SUS shell. -55 Degree C to 85 Degree C operating range.
Shenzhen Gaorunxin Technology Co., Ltd
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.
Raised double-layer 10G design. 1.8A power delivery.
2.63mm board-mount height, reverse orientation. 30V DC, 100M?? insulation.
180 Degree Type-B female. SPCC shell, UL94-V0 housing.
Four-layer architecture. SUS shell with fog-tin plating.
0.36mm mount height, reverse orientation. U2/U3 contacts.
90 Degree double-layer design with 4 pins. 1.5A current, 30V DC, UL94-V0 housing.
Quad-port USB 3.0 AF connector. 1.8A power delivery per port.
19.64mm length, straight-edge + forked pins. SUS shell.
Triple-layer stackable design. Front-accessible Type-C ports.