0.5mm mount height, forward orientation. SUS shell.
Ultra-low-profile SMT connector. Automated PCB assembly compatible.
Shenzhen Gaorunxin Technology Co., Ltd
Hybrid USB 3.0 + Type-C. 90 Degree orientation, nickel-plated SUS.
4.14mm height, reverse-mount design. No flange, brass shell.
Unrolled-edge forward fork pins. SUS shell with nickel plating.
9.50mm raised base. Nickel-plated brass shell.
19.64mm length, rolled-edge + bent pins. Nickel-plated SUS.
6.15mm height with locking clip. SK7 shell, 30V rating.
Raised double-layer 10G design. 1.8A power delivery.
Double-to-single layer conversion. Raised base for thermal management.
Three-layer stacked design. Fog-tin plated contacts.
Two-tone housing. 90 Degree bent pins, U2/U3 protocol support.