GEN2 protocol, 3.40mm height. Forward bent-pin design.
Low-clearance connector with 10Gbps speed. 100V dielectric strength.
Shenzhen Gaorunxin Technology Co., Ltd
Triple-layer stackable design. Front-accessible Type-C ports.
13.70mm height (duplicate). UL94-V0 housing, 30V DC.
Double-to-single layer conversion. Raised base for thermal management.
Rolled-edge, forked pins. Brass shell, 30V rating.
Type-B female port. 90 Degree bent pins, PBT housing.
Dual Type-C ports. 180 Degree orientation, brass shell.
Quad-port USB 3.0 AF connector. 1.8A power delivery per port.
13.70mm height. Nickel-plated brass shell.
180 Degree Type-B female. SPCC shell, UL94-V0 housing.
2xU2 upper + 2xU3 lower layers. Fog-tin plated SUS shell.