CRTS080P04L2-G CR Micro -40V -80A P-Channel MOSFET TO-263 or D2PAK
CRTS080P04L2-G CR Micro -40V -80A P-Channel MOSFET TO-263 or D2PAK

CRTS080P04L2-G CR Micro -40V -80A P-Channel MOSFET TO-263 or D2PAK

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pCRTS080P04L2-G CR Micro -40V -80A P-Channel MOSFET TO-263 or D2PAK — Rds(on) 6.5 mΩ typ, Qg 108 nC./p
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    At a Glance
    • -40 V / -80 A continuous drain current, TO-263 or D2PAK package
    • Rds(on) 6.5 mΩ typ, 8 mΩ max at VGS = 10 V
    • Qg 108 nC and Ciss 5691 pF
    • P-channel, Trench process

    The CR Micro CRTS080P04L2-G is a -40 V -80 A P-channel MOSFET in a TO-263 or D2PAK package, built on the Trench process. On-resistance is 6.5 mΩ typical and 8 mΩ maximum at a 10 V gate drive; 8.3 mΩ typical at 4.5 V, so it also works from a logic-level driver; gate charge is 108 nC with 5691 pF input capacitance; threshold voltage spans -1 to -3 V.

    Key Specifications

    Drain-Source Voltage (VDS)-40 V
    Continuous Drain Current (ID)-80 A
    Rds(on) @ VGS = 10 V, typ.6.5 mΩ
    Rds(on) @ VGS = 10 V, max.8 mΩ
    Rds(on) @ VGS = 4.5 V, typ.8.3 mΩ
    Rds(on) @ VGS = 4.5 V, max.10.5 mΩ
    Gate Threshold Voltage (VGS(th))-1 – -3 V
    Total Gate Charge (Qg)108 nC
    Input Capacitance (Ciss)5691 pF
    Channel PolarityP-channel
    Process FamilyTrench
    PackageTO-263 or D2PAK

    Process Technology

    Trench — the gate is etched vertically into the drift region, multiplying channel width per unit area. Lowest Rds(on) in the sub-200 V range; the trade-off is higher Qg and a more fragile body diode under hard commutation.

    Applications

    Low-voltage DC-DC converters, load switches, battery protection, and brushed or stepper motor drive.

    Selection Notes

    • Rds(on) rises with junction temperature. Size the heatsink against the hot value given in the datasheet, not the 25 °C number in the table above.
    • If the gate is driven below 10 V, check the 4.5 V Rds(on) line — parts without that rating are not characterised for logic-level drive.
    • For high-frequency stages compare Qg and Ciss against the Rds(on) gain. A part one bin lower in Rds(on) often costs more switching loss than it saves in conduction.
    • The body diode recovery of low-Rds(on) parts can be severe in bridge topologies. Verify dv/dt and dead time against the datasheet before dropping it into a half bridge.

    Common Questions

    Is the CRTS080P04L2-G an N-channel or P-channel device?

    It is P-channel. The drain-source rating is -40 V.

    Can the CRTS080P04L2-G be driven from a 4.5 V logic-level gate signal?

    Yes. The datasheet characterises Rds(on) at 4.5 V: 8.3 mΩ typical and 10.5 mΩ maximum.

    What is the gate threshold voltage of the CRTS080P04L2-G?

    VGS(th) is specified between -1 and -3 V. Below the lower figure the part is off; above the upper figure it is fully on at the rated current.

    How much gate charge does the CRTS080P04L2-G need?

    Qg is 108 nC. Size the driver against that figure at your switching frequency, and add the gate loop loss to the total dissipation budget.

    What package does the CRTS080P04L2-G come in?

    TO-263 or D2PAK. Check the datasheet mechanical drawing for lead spacing and thermal pad dimensions before laying out the footprint.

    Shenzhen Gaorunxin Technology Co., Ltd

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