4.31mm mount depth. SUS shell with nickel plating.
Deep-mount connector with 30m ohm contact resistance. 100V dielectric strength.
Shenzhen Gaorunxin Technology Co., Ltd
GEN2 protocol, 3.40mm height. Forward bent-pin design.
GEN2 protocol support. Straight pins, SUS shell.
4.31mm board-mount depth. Forward orientation, bent pins.
4.14mm height, reverse-mount design. No flange, brass shell.
Double-to-single layer conversion with raised base. 30V DC, 100V dielectric strength.
Raised double-layer design. HDMI + USB 3.1 integration.
Rolled-edge + forked pins. Support feet, brass shell.
6.15mm height with locking clip. SK7 shell, 30V rating.
12.80mm pitch, 90 Degree double-layer design. 30V DC, 100V withstand voltage.
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.