Unrolled-edge forward fork pins. SUS shell with nickel plating.
Low-impedance (30m ohm) connector. 100V withstand voltage for harsh environments.
Shenzhen Gaorunxin Technology Co., Ltd
14.8mm height. Phosphor bronze contacts, brass shell.
14.80mm height, rolled-edge. Copper alloy contacts.
Raised double-layer 10G design. 1.8A power delivery.
Dual Type-C ports. 180 Degree orientation, brass shell.
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.
Raised double-layer design. HDMI + USB 3.1 integration.
2xU2 upper + 2xU3 lower layers. Fog-tin plated SUS shell.
4.31mm mount depth. SUS shell with nickel plating.
Three-port stacked design. Non-spring contacts, DIP termination.
2.80mm mount height. Forward bent-pin design.