Full-surface SMT design. Nickel-plated brass shell.
Lead-free connector compatible with reflow soldering. RoHS compliant.
Shenzhen Gaorunxin Technology Co., Ltd
90 Degree dual Type-C ports. SUS shell, nickel plating.
9.50mm raised base. Nickel-plated brass shell.
180 Degree locking mechanism. 1.8A power delivery, SUS shell.
180 Degree hybrid design. Copper alloy contacts, brass shell.
Unrolled-edge forward fork pins. SUS shell with nickel plating.
Straight pins, flat-edge design. 10Gbps data transfer.
2.80mm board-mount height. Reverse bent-pin design.
Triple-layer fork-pin design. 1.5A current, 30m ohm contact resistance.
GEN2 protocol, 3.40mm height. Forward bent-pin design.
4.31mm board-mount depth. Forward orientation, bent pins.