Double-to-single layer conversion. Raised base for thermal management.
Space-optimized connector with BRASS contacts. 30m ohm contact resistance.
Shenzhen Gaorunxin Technology Co., Ltd
4.14mm height, reverse-mount design. No flange, brass shell.
9.50mm raised base. Nickel-plated brass shell.
12.80mm pitch, 90 Degree double-layer design. 30V DC, 100V withstand voltage.
Quad-port USB 3.0 AF connector. 1.8A power delivery per port.
180 Degree hybrid design. Copper alloy contacts, brass shell.
Long-body side-mount with bent pins. 30V DC, UL94-V0 housing.
Reverse-mount double-layer design. 30V DC, 100V dielectric strength.
IP-rated vertical Type-C. SUS shell, nickel plating.
Straight pins, flat-edge design. 10Gbps data transfer.
Rolled-edge, forked pins. Brass shell, 30V rating.