2xU2 upper + 2xU3 lower layers. Fog-tin plated SUS shell.
Multi-protocol connector with 100M ohm insulation. Backward compatible with USB 2.0/3.0.
Shenzhen Gaorunxin Technology Co., Ltd
14.80mm height, rolled-edge. Copper alloy contacts.
Straight-pin DIP design. Brass/SUS shell, 1.5A current rating.
6.15mm height with locking clip. SK7 shell, 30V rating.
6.26mm height, straight pins. Copper alloy contacts.
IP-rated vertical Type-C. SUS shell, nickel plating.
Front-stackable design. Raised single layer, 10Gbps speed.
4.31mm mount depth. SUS shell with nickel plating.
Long-body side-mount with bent pins. 30V DC, UL94-V0 housing.
Rolled-edge + forked pins. Support feet, brass shell.
Dual-protocol integration. PBT+LCP housing, 30V rating.