2xU2 upper + 2xU3 lower layers. Fog-tin plated SUS shell.
Multi-protocol connector with 100M ohm insulation. Backward compatible with USB 2.0/3.0.
Shenzhen Gaorunxin Technology Co., Ltd
90 Degree bent-pin termination. PBT/UL94-V0 housing.
4.31mm mount depth. SUS shell with nickel plating.
Four-layer stacked design. 2.80mm pitch, bent-pin termination.
0.5mm mount height, forward orientation. SUS shell.
Three-port stacked design. Non-spring contacts, DIP termination.
Double-to-single layer conversion with raised base. 30V DC, 100V dielectric strength.
Rolled-edge, forked pins. Brass shell, 30V rating.
Double-to-single layer conversion. Raised base for thermal management.
GEN2 protocol, 3.40mm height. Forward bent-pin design.
3.36mm height, straight-pin forward mount. 30m?? contact resistance.