2.63mm board-mount height, reverse orientation. 30V DC, 100M?? insulation.
Low-profile connector with SK7 shell. Ideal for space-constrained applications.
Shenzhen Gaorunxin Technology Co., Ltd
Triple-layer fork-pin design. 1.5A current, 30m ohm contact resistance.
14.80mm height, rolled-edge. Copper alloy contacts.
Unrolled-edge forward fork pins. SUS shell with nickel plating.
Double-to-single layer conversion with raised base. 30V DC, 100V dielectric strength.
Rolled-edge, forked pins. Brass shell, 30V rating.
Raised double-layer design. HDMI + USB 3.1 integration.
19.64mm length, rolled-edge + forked pins. 30V DC rating.
Straight-pin DIP design. Brass/SUS shell, 1.5A current rating.
Forked pins with locking clip. 6.15mm height, 30V DC rating.
0.60mm SMT height. Copper alloy contacts, brass shell.