2.63mm board-mount height, reverse orientation. 30V DC, 100M?? insulation.
Low-profile connector with SK7 shell. Ideal for space-constrained applications.
Shenzhen Gaorunxin Technology Co., Ltd
Unrolled-edge reverse orientation. 1.8A/0.25A contact configuration.
Double-to-single layer conversion with raised base. 30V DC, 100V dielectric strength.
Rolled-edge forward design. Selective gold/tin plating on contacts.
13.70mm height. Nickel-plated brass shell.
3.36mm height, straight-pin forward mount. 30m?? contact resistance.
Double-to-single layer conversion. Raised base for thermal management.
9.50mm raised base. Nickel-plated brass shell.
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.
Rolled-edge + forked pins. Support-free design.
GEN2 protocol, straight pins. Nickel-plated SUS shell.