0.60mm SMT height. Copper alloy contacts, brass shell.
Surface-mount connector for automated manufacturing. 100V dielectric strength.
Shenzhen Gaorunxin Technology Co., Ltd
Three-layer stacked design. Fog-tin plated contacts.
13.70mm height (duplicate). UL94-V0 housing, 30V DC.
180 Degree Type-B female. SPCC shell, UL94-V0 housing.
Four-layer stacked design. 2.80mm pitch, bent-pin termination.
Four-layer architecture. SUS shell with fog-tin plating.
Reverse-mount double-layer design. 30V DC, 100V dielectric strength.
4.14mm height, reverse-mount design. No flange, brass shell.
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.
Unrolled-edge reverse orientation. 1.8A/0.25A contact configuration.
Straight-pin DIP design. Brass/SUS shell, 1.5A current rating.