Front-stackable design. Raised single layer, 10Gbps speed.
Modular Type-C connector with fog-tin plating. 30V DC/100V AC ratings.
Shenzhen Gaorunxin Technology Co., Ltd
13.70mm height (duplicate). UL94-V0 housing, 30V DC.
Triple-layer stackable design. Front-accessible Type-C ports.
Raised double-layer 10G design. 1.8A power delivery.
GEN2 protocol, straight pins. Nickel-plated SUS shell.
Straight-pin DIP design. Brass/SUS shell, 1.5A current rating.
Type-B female port. 90 Degree orientation, copper alloy contacts.
Dual-protocol integration. PBT+LCP housing, 30V rating.
Rolled-edge + forked pins. Support-free design.
19.64mm length, straight-edge + forked pins. SUS shell.
Unrolled-edge forward fork pins. SUS shell with nickel plating.