Triple-layer stackable design. Front-accessible Type-C ports.
High-density connector with BRASS contacts. Supports 10Gbps data transfer.
Shenzhen Gaorunxin Technology Co., Ltd
19.64mm length, rolled-edge + bent pins. Nickel-plated SUS.
Raised double-layer 10G design. 1.8A power delivery.
Three-layer stacked design. Fog-tin plated contacts.
Four-layer stacked design. 2.80mm pitch, bent-pin termination.
2.80mm board-mount height. Reverse bent-pin design.
Raised double-layer design. HDMI + USB 3.1 integration.
180 Degree hybrid design. Copper alloy contacts, brass shell.
Quad-port USB 3.0 AF connector. 1.8A power delivery per port.
12.80mm pitch, 90 Degree double-layer design. 30V DC, 100V withstand voltage.
6.15mm height with locking clip. SK7 shell, 30V rating.