Three-port stacked design. Non-spring contacts, DIP termination.
High-efficiency hub connector with selective gold/tin plating. 30V DC rating.
Shenzhen Gaorunxin Technology Co., Ltd
Triple-layer stackable design. Front-accessible Type-C ports.
90 Degree dual Type-C ports. SUS shell, nickel plating.
GEN2 protocol support. Straight pins, SUS shell.
180 Degree hybrid design. Copper alloy contacts, brass shell.
4.14mm height, reverse-mount design. No flange, brass shell.
3.36mm height, straight-pin forward mount. 30m?? contact resistance.
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.
Front-stackable design. Raised single layer, 10Gbps speed.
2.80mm mount height. Forward bent-pin design.
Triple-layer fork-pin design. 1.5A current, 30m ohm contact resistance.