14.8mm height. Phosphor bronze contacts, brass shell.
Tall-profile connector for deep-chassis mounting. 30V DC rating.
Shenzhen Gaorunxin Technology Co., Ltd
Three-port stacked design. Non-spring contacts, DIP termination.
2xU2 upper + 2xU3 lower layers. Fog-tin plated SUS shell.
2.63mm board-mount height, reverse orientation. 30V DC, 100M?? insulation.
0.60mm SMT height. Copper alloy contacts, brass shell.
0.36mm mount height, reverse orientation. U2/U3 contacts.
Triple-layer fork-pin design. 1.5A current, 30m ohm contact resistance.
14.80mm height, rolled-edge. Copper alloy contacts.
IP-rated vertical Type-C. SUS shell, nickel plating.
Hybrid USB 3.0 + Type-C. 90 Degree orientation, nickel-plated SUS.
Double-to-single layer conversion. Raised base for thermal management.