3.36mm height, straight-pin forward mount. 30m?? contact resistance.
High-reliability connector with phosphor bronze contacts. Industrial temperature range.
Shenzhen Gaorunxin Technology Co., Ltd
0.5mm mount height, forward orientation. SUS shell.
Straight pins, flat-edge design. 10Gbps data transfer.
Dual Type-C ports. 180 Degree orientation, brass shell.
2.80mm board-mount height. Reverse bent-pin design.
Rolled-edge + forked pins. Support feet, brass shell.
0.60mm SMT height. Copper alloy contacts, brass shell.
GEN2 protocol, 3.40mm height. Forward bent-pin design.
Rolled-edge forward design. Selective gold/tin plating on contacts.
Three-port stacked design. Non-spring contacts, DIP termination.
Four-layer architecture. SUS shell with fog-tin plating.