6.26mm height, straight pins. Copper alloy contacts.
Low-profile connector with 1.8A power delivery. Board-edge applications.
Shenzhen Gaorunxin Technology Co., Ltd
2.63mm board-mount height, reverse orientation. 30V DC, 100M?? insulation.
Unrolled-edge forward fork pins. SUS shell with nickel plating.
Rolled-edge forward design. Selective gold/tin plating on contacts.
0.60mm SMT height. Copper alloy contacts, brass shell.
19.64mm length, straight-edge + forked pins. SUS shell.
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.
12.80mm pitch, 90 Degree double-layer design. 30V DC, 100V withstand voltage.
Rolled-edge + forked pins. Support feet, brass shell.
2xU2 upper + 2xU3 lower layers. Fog-tin plated SUS shell.
IP67-rated 180 Degree design. Copper alloy contacts, brass shell.