6.26mm height, straight pins. Copper alloy contacts.
Low-profile connector with 1.8A power delivery. Board-edge applications.
Shenzhen Gaorunxin Technology Co., Ltd
GEN2 protocol, 3.40mm height. Forward bent-pin design.
Three-port stacked design. Non-spring contacts, DIP termination.
14.80mm height, rolled-edge. Copper alloy contacts.
13.70mm height (duplicate). UL94-V0 housing, 30V DC.
Front-stackable design. Raised single layer, 10Gbps speed.
Rolled-edge + forked pins. Support feet, brass shell.
2.63mm board-mount height, reverse orientation. 30V DC, 100M?? insulation.
Vertical SMT, unrolled-edge. SPCC shell, 30V DC.
Unrolled-edge reverse orientation. 1.8A/0.25A contact configuration.
Quad-port USB 3.0 AF connector. 1.8A power delivery per port.