Four-layer stacked design. 2.80mm pitch, bent-pin termination.
High-density connector supporting U2/U3 protocols. Nickel-plated SUS construction.
Shenzhen Gaorunxin Technology Co., Ltd
Four-layer architecture. SUS shell with fog-tin plating.
7A high-current, IP-rated. 16-pin Type-C, -40Degree C to 125Degree C.
Double-to-single layer conversion with raised base. 30V DC, 100V dielectric strength.
GEN2 protocol support. Straight pins, SUS shell.
Straight-pin DIP design. Brass/SUS shell, 1.5A current rating.
6.15mm height with locking clip. SK7 shell, 30V rating.
Front-stackable design. Raised single layer, 10Gbps speed.
Straight pins, flat-edge design. 10Gbps data transfer.
90 Degree dual Type-C ports. SUS shell, nickel plating.
Triple-layer stackable design. Front-accessible Type-C ports.