Four-layer architecture. SUS shell with fog-tin plating.
Ultra-high-density connector. Supports simultaneous multi-device charging.
Shenzhen Gaorunxin Technology Co., Ltd
Dual-protocol integration. PBT+LCP housing, 30V rating.
12.80mm pitch, 90 Degree double-layer design. 30V DC, 100V withstand voltage.
Straight pins, flat-edge design. 10Gbps data transfer.
0.5mm mount height, forward orientation. SUS shell.
90 Degree double-layer design with 4 pins. 1.5A current, 30V DC, UL94-V0 housing.
3.36mm height, straight-pin forward mount. 30m?? contact resistance.
Unrolled-edge reverse orientation. 1.8A/0.25A contact configuration.
Three-port stacked design. Non-spring contacts, DIP termination.
4.31mm board-mount depth. Forward orientation, bent pins.
Front-stackable design. Raised single layer, 10Gbps speed.