Pot Ferrite Core has small size, high inductance, convenient winding, balanced magnetic shielding and heat dissipation.

Precision semiconductor test probes for IC testing, burn-in analysis & data communication. 0.3mm-2.54mm spacing solutions for chip packaging, AI devices, 5G communications, and RF testing. Custom probe configurations available for mobile tech, high-end connectors, and industrial applications.

DSX320GE AEC-Q200 compliant SMD crystal resonator (0.95mm height, 7.9 to 64MHz), optimized for automotive ECU, APS, EBS. Features 3000-cycle thermal durability (-40℃ to +125℃), high precision, and heat resistance for engine/body control systems in harsh environments.

DSB221SDN 9.6-52MHz low-voltage clipped sine wave crystal with ultra-low phase noise and compact single-package design. Ideal for mobile phones, GPS/GNSS, and industrial radio systems, ensuring precise signal stability in power-sensitive applications.

DT-38, DT-381, DT-26, DT-261 Series Low-Power Tuning Fork Crystal Resonators (32.768kHz to 90kHz), RoHS compliant, 1.0μW ultra-low drive level. Ideal for watches, IoT, and industrial systems with customizable load capacitance, no moisture-proof packaging required.

3215 ultra-thin SMD tuning fork crystal resonator with 0.75mm low-profile ceramic-metal package, 50khz series resistance, AEC-Q200 certified. Ideal for automotive multimedia, mobile communications, and smart appliances, ensuring reliable frequency control in harsh environments.

Ultra-thin 0.75mm SMD crystal resonator for 12MHz+ applications, AEC-Q200 compliant. Combines miniature design, excellent heat resistance, and automotive-grade reliability. Optimized for car navigation, audio systems, and harsh-environment multimedia devices.

DSX221G is 2520 SMD Crystal Resonators (12MHz-64MHz) with AEC-Q200 compliance, 0.75mm ultra-low profile, and superior heat resistance. Ideal for Bluetooth, GPS, Wi-Fi, RKE systems, and automotive safety controls. Reliable MHz-band solutions for precision and durability.

Precision semiconductor test probes for IC testing, burn-in analysis & data communication. 0.3mm-2.54mm spacing solutions for chip packaging, AI devices, 5G communications, and RF testing. Custom probe configurations available for mobile tech, high-end connectors, and industrial applications.

Precision semiconductor test probes for IC testing, burn-in analysis & data communication. 0.3mm-2.54mm spacing solutions for chip packaging, AI devices, 5G communications, and RF testing. Custom probe configurations available for mobile tech, high-end connectors, and industrial applications.

Precision semiconductor test probes for IC testing, burn-in analysis & data communication. 0.3mm-2.54mm spacing solutions for chip packaging, AI devices, 5G communications, and RF testing. Custom probe configurations available for mobile tech, high-end connectors, and industrial applications.

Precision semiconductor test probes for IC testing, burn-in analysis & data communication. 0.3mm-2.54mm spacing solutions for chip packaging, AI devices, 5G communications, and RF testing. Custom probe configurations available for mobile tech, high-end connectors, and industrial applications.