GRX Technology Co, Ltd
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2.3mm Semiconductor Test Probe| 0.31mm dia 1A | Wafer test

2.3mm Semiconductor Test Probe| 0.31mm dia 1A | Wafer test

Precision semiconductor test probes for IC testing, burn-in analysis & data communication. 0.3mm-2.54mm spacing solutions for chip packaging, AI devices, 5G communications, and RF testing. Custom probe configurations available for mobile tech, high-end connectors, and industrial applications.
10mm Semiconductor Test Probe| 0.28mm dia 1A | Chip test

10mm Semiconductor Test Probe| 0.28mm dia 1A | Chip test

Precision semiconductor test probes for IC testing, burn-in analysis & data communication. 0.3mm-2.54mm spacing solutions for chip packaging, AI devices, 5G communications, and RF testing. Custom probe configurations available for mobile tech, high-end connectors, and industrial applications.
10mm Semiconductor Probe| 0.28mm dia 1A | IC Test

10mm Semiconductor Probe| 0.28mm dia 1A | IC Test

Precision semiconductor test probes for IC testing, burn-in analysis & data communication. 0.3mm-2.54mm spacing solutions for chip packaging, AI devices, 5G communications, and RF testing. Custom probe configurations available for mobile tech, high-end connectors, and industrial applications.
4mm Semiconductor Probe| 0.28mm dia 1A | Wafer Test

4mm Semiconductor Probe| 0.28mm dia 1A | Wafer Test

Precision semiconductor test probes for IC testing, burn-in analysis & data communication. 0.3mm-2.54mm spacing solutions for chip packaging, AI devices, 5G communications, and RF testing. Custom probe configurations available for mobile tech, high-end connectors, and industrial applications.
4mm Semiconductor Probe| 0.26mm dia 1A | For Probe Card

4mm Semiconductor Probe| 0.26mm dia 1A | For Probe Card

Precision semiconductor test probes for IC testing, burn-in analysis & data communication. 0.3mm-2.54mm spacing solutions for chip packaging, AI devices, 5G communications, and RF testing. Custom probe configurations available for mobile tech, high-end connectors, and industrial applications.
3.1mm Semiconductor Probe| 0.26mm dia 1A | For Probe Card

3.1mm Semiconductor Probe| 0.26mm dia 1A | For Probe Card

Precision semiconductor test probes for IC testing, burn-in analysis & data communication. 0.3mm-2.54mm spacing solutions for chip packaging, AI devices, 5G communications, and RF testing. Custom probe configurations available for mobile tech, high-end connectors, and industrial applications.
4mm Semiconductor Probe| 0.2mm dia 1A | Pd Alloy

4mm Semiconductor Probe| 0.2mm dia 1A | Pd Alloy

Precision semiconductor test probes for IC testing, burn-in analysis & data communication. 0.3mm-2.54mm spacing solutions for chip packaging, AI devices, 5G communications, and RF testing. Custom probe configurations available for mobile tech, high-end connectors, and industrial applications.
4mm Semiconductor Probe| 0.2mm dia 1A | Wafer Prober Application

4mm Semiconductor Probe| 0.2mm dia 1A | Wafer Prober Application

Precision semiconductor test probes for IC testing, burn-in analysis & data communication. 0.3mm-2.54mm spacing solutions for chip packaging, AI devices, 5G communications, and RF testing. Custom probe configurations available for mobile tech, high-end connectors, and industrial applications.
4mm Semiconductor Probe| 0.15mm dia 0.2A | Wafer Test

4mm Semiconductor Probe| 0.15mm dia 0.2A | Wafer Test

Precision semiconductor test probes for IC testing, burn-in analysis & data communication. 0.3mm-2.54mm spacing solutions for chip packaging, AI devices, 5G communications, and RF testing. Custom probe configurations available for mobile tech, high-end connectors, and industrial applications.
High-frequency Semiconductor Test Probe Double Headed Spring Probe

High-frequency Semiconductor Test Probe Double Headed Spring Probe

High-frequency semiconductor testing probes for wafer validation, chip packaging, and communication electronics. Features ultra-low contact resistance (<1mΩ) and 5-40GHz bandwidth, optimized for 5G, automotive, and IoT precision testing.
Semiconductor Test Probe Moving both ends / Moving one

Semiconductor Test Probe Moving both ends / Moving one

High-frequency semiconductor testing probes for wafer validation, chip packaging, and communication electronics. Features ultra-low contact resistance (<1mΩ) and 5-40GHz bandwidth, optimized for 5G, automotive, and IoT precision testing.
Tomita EER Type Ferrite Cores

Tomita EER Type Ferrite Cores

The EER Cores have a good coupling position and a circular center column, which is convenient for winding and increases the winding area, so a transformer with high power and low leakage inductance can be designed.
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