2xU2 upper + 2xU3 lower layers. Fog-tin plated SUS shell.
Triple-layer stackable design. Front-accessible Type-C ports.
Front-stackable design. Raised single layer, 10Gbps speed.
Straight pins, flat-edge design. 10Gbps data transfer.
4.31mm mount depth. SUS shell with nickel plating.
4.31mm board-mount depth. Forward orientation, bent pins.
2.80mm mount height. Forward bent-pin design.
Two-tone housing. 90 Degree bent pins, U2/U3 protocol support.
Three-port stacked design. Non-spring contacts, DIP termination.
2.80mm board-mount height. Reverse bent-pin design.
Four-layer stacked design. 2.80mm pitch, bent-pin termination.
6.15mm height with locking clip. SK7 shell, 30V rating.
